ZTT recently showcased its latest optical interconnect solutions at OFC 2026 in Los Angeles, highlighting innovations designed to meet the rapidly evolving demands of AI and next-generation telecom networks.
At the exhibition, ZTT presented a comprehensive portfolio spanning from high-speed copper and advanced optical fibers to a full range of optical modules and core chips.
AI & Data Centers
We unveiled our 1.6T silicon photonics module, built on 200G per-lane technology, alongside our 800G product series (including DSP, LPO, and AOC), enabling high-performance computing and AI-driven infrastructure.
Telecom Networks
Our portfolio featured 400G / 100G / 25G / 10G single-mode modules for mid- to long-reach transmission, with solutions supporting distances of up to 100 km for metro and backbone networks.
Core Components
We also highlighted our latest high-speed modulation chips, leveraging silicon photonics and thin-film lithium niobate technologies to deliver higher integration and lower power consumption.
As global demand for data and computing power continues to accelerate, ZTT remains committed to delivering reliable, high-performance, and energy-efficient solutions for data centers and communication networks worldwide.
